| Original document(11 pages) 中文版 |
This invention relates to an image scan module making method, which includes: making circuit substrate; fixing the ordinary electrode components on the circuit substrate; fixing the photographic components and IC electrode components at the designed place of the circuit substrate; connecting the photographic components and IC electrode components with the circuit substrate by down-lead joint method to complete the image scan module making; providing module die holder, and assembling at least one reflecting mirror or lens component at the designed place of the circuit substrate; fixing the image photographic substrate in the substrate assembling area of the module die holder, and arranging it at the place where the lens component produces focusing image to complete the image scan module making. |
Application Number
申请号 |
200510055756 |
Application Date
申请日 |
2005.03.21 |
| Title 名称 |
Image scanning module making method
|
Publication Number
公开号 |
1838418 |
Publication Date
公开日 |
2006.09.27 |
| Approval Pub. Date |
|
Granted Pub. Date |
|
| International Classification 分类号 |
H01L27/14,H01L21/50,H04N5/335 |
Applicant(s) Name
申请人 |
Creative Sensor Inc. |
| Address 地址 |
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| Inventor(s) Name 发明人 |
Li Pengrong, Su Lingda |
| Attorney & Agent 代理人 |
yu mang fang ting |
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