| Original document(21 pages) 中文版 |
A heat receiving sheet for receiving heat from electronic components comprises a heat transfer part and a heat insulation part. A heat-generating component which is an electronic component having a high heat generation rate contacts with the heat transfer part of the heat receiving sheet, while a low-temperature component which is an electronic component having a low heat generation rate and having thermal weakness contacts with the heat insulation part of the heat receiving sheet. The heat generated in the heat-generating component is transmitted to the heat receiving sheet (heat transfer part) in a contacted state, so that the heat-generating component is cooled. The low-temperature component contacts with the heat insulation part, hence does not receive via the heat receiving sheet the heat generated in the heat-generating component. |
Application Number
申请号 |
200510087697 |
Application Date
申请日 |
2005.07.29 |
| Title 名称 |
Heat receiving sheet, electronic apparatus, and fabrication method for heat receiving sheet
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Publication Number
公开号 |
1838405 |
Publication Date
公开日 |
2006.09.27 |
| Approval Pub. Date |
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Granted Pub. Date |
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| International Classification 分类号 |
H01L23/36,H05K7/20,B29C45/14,B29C39/10 |
Applicant(s) Name
申请人 |
Fujitsu Ltd. |
| Address 地址 |
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| Inventor(s) Name 发明人 |
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| Attorney & Agent 代理人 |
li chunhui |
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