Original document(21 pages)  中文版
    A substrate housing method for a substrate processing apparatus, including: a first step of transporting the substrate taken out from a housing case to the substrate processing apparatus by a transport means; a third step of processing the substrate at the substrate processing apparatus; a fourth step of returning the substrate after the third step to the housing case by the transport means; a second step of calculating a difference in amount in relation to a normal position of the substrate at the transport means from the first step and before the fourth step; and a fifth step of adjusting a returning position of the substrate in the housing case after the third step and until the fourth step.
Application Number
申请号
200610057058 Application Date
申请日
2006.03.17
Title 名称 Substrate processing apparatus and substrate housing method
Publication Number
公开号
1838398 Publication Date
公开日
2006.09.27
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H01L21/677,H01L21/00
Applicant(s) Name
申请人
Olympus Corp.
Address 地址
Inventor(s) Name 发明人
Attorney & Agent 代理人 chen jian

  
Semiconductor wafer inspection apparatus
Substrate processing device and substrate processing system
Visual inspection apparatus
Method and apparatus for planarizing gap-filling material
Method for manufacturing semiconductor device
Method of fabricating a bottle trench and a bottle trench capacitor
Method of fabricating flash memory device
Housing for solid shooting element and solid shooting apparatus
Heat radiation module assembly
Heat receiving sheet, electronic apparatus, and fabrication method for heat receiving sheet
Google
Note:All patent data come from State Intellectual Property Office of the People's Republic of China. If there were discrepancies between here and the State Intellectual Property office, the later is more accurate. The patent data is only for public exchange and learning purposes. We are not responsible for the adverse consequences with unverified use of the data.