Original document(16 pages)  中文版
    The invention provides an undercut-free conductor circuit which can be produced by additive process without dry processing or dry processing device, and a method of producing the same. The printed wiring board of the invention has an undercut-free conductor circuit produced by performing additional plating to fill an undercut.
Application Number
申请号		 200480023156 Application Date
申请日		 2004.08.11
Title 名称 Printed wiring board and method of producing the same
Publication Number
公开号		 1836472 Publication Date
公开日		 2006.09.20
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H05K3/18,H05K3/22
Applicant(s) Name
申请人		 Fujikura Ltd.
Address 地址
Inventor(s) Name 发明人 Fujinami Hideyuki, Higuchi Reiji
Attorney & Agent 代理人 zhong qiang guan zhaohui

  
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