| Original document(18 pages) 中文版 |
Disclosed is a circuit device wherein a plurality of circuit elements including a circuit element having a hollow space inside are sealed with a resin. Also disclosed is a method for manufacturing such a circuit device. A circuit device (10) comprises a first circuit element (13A) having a hollow space inside and a plurality of second circuit elements (13B) electrically connected with the first circuit element (13A). The first circuit element (13A) and the second circuit elements (13B) are sealed with a sealing resin (15). The distances between the first circuit element (13A) and each second circuit element (13B) are longer than the distances between respective second circuit elements (13B). |
Application Number
申请号 |
200480022901 |
Application Date
申请日 |
2004.09.01 |
| Title 名称 |
Circuit device and method for manufacturing same
|
Publication Number
公开号 |
1836329 |
Publication Date
公开日 |
2006.09.20 |
| Approval Pub. Date |
|
Granted Pub. Date |
|
| International Classification 分类号 |
H01L25/04,H01L25/18,H01L21/56,H01L23/50 |
Applicant(s) Name
申请人 |
Sanyo Electric Co. |
| Address 地址 |
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| Inventor(s) Name 发明人 |
Imaizumi Hideo, Kato Takuji, Nakajima Kenichi, Harigai Masami, Kuwata Masachika, Ochiai Isao, Tsubonoya Makoto, Shibusawa Katsuhiko |
| Attorney & Agent 代理人 |
li guiliang yang wu |
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