| Original document(22 pages) 中文版 |
A method to join pipe is disclosed using a curable one or two part adhesive composition comprising an effective amount of a boron containing initiator compound such as an organoborate, a stabilized organoborane complex, or combinations thereof; one or more monomers, oligomers, polymers or mixtures thereof having olefinic unsaturation which is capable of polymerization by free radical polymerization; and optionally a decomplexing agent. |
Application Number
申请号 |
200480023076 |
Application Date
申请日 |
2004.08.13 |
| Title 名称 |
Method for joining substrates and objects
|
Publication Number
公开号 |
1835992 |
Publication Date
公开日 |
2006.09.20 |
| Approval Pub. Date |
|
Granted Pub. Date |
|
| International Classification 分类号 |
C08J5/12,C09J11/06,C09J4/00,C09J4/06 |
Applicant(s) Name
申请人 |
Dow Global Technologies Inc. |
| Address 地址 |
|
| Inventor(s) Name 发明人 |
Sehanobish Kalyan, Falla Daniel James, Wu Shaofu |
| Attorney & Agent 代理人 |
cheng wei |
|
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