Original document(19 pages)  中文版
    A printed wiring board is disclosed. The printed wiring board includes a board recognition mark formed of a conductive foil, a first component land covered with resist, and a second component land not covered with the resist. The board recognition mark is defined by an area of the conductive foil exposed from a resist opening having the same shape and size as the conductive foil.
Application Number
申请号		 200610067395 Application Date
申请日		 2006.03.20
Title 名称 Printed wiring board, manufacturing method therefor, and mounting method therefor
Publication Number
公开号		 1835655 Publication Date
公开日		 2006.09.20
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H05K1/02,H05K3/34,H05K13/06,G01B11/24,G01B11/00
Applicant(s) Name
申请人		 Ricoh KK
Address 地址
Inventor(s) Name 发明人
Attorney & Agent 代理人 yang wu wang jinggang

  
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