Original document(20 pages)  中文版
    A method for manufacturing a semiconductor package with a laminated chip cavity is disclosed. A board and a metal foil having a layer of adhesive resin are provided. The metal foil is laminated with the board to make the adhesive resin be attached to the board. Next, a through opening is formed to pass through the board, the adhesive resin and the metal foil. Next, the metal foil is removed to expose an adhesive surface of the adhesive resin on the board so as to attach a carrier plate, thereby forming a chip cavity.
Application Number
申请号		 200510068084 Application Date
申请日		 2005.05.16
Title 名称 Method for manufacturing a semiconductor package with a laminated chip cavity
Publication Number
公开号		 1835195 Publication Date
公开日		 2006.09.20
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H01L21/48,H01L21/50,H01L21/60
Applicant(s) Name
申请人		 Advanced Semiconductor Eng
Address 地址
Inventor(s) Name 发明人 Appelt Bernd K.
Attorney & Agent 代理人 dong huishi

  
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