| Original document(24 pages) 中文版 |
A resistor with heat sink is provided. The heat sink includes a conductive path having metal or other thermal conductor having a high thermal conductivity. To avoid shorting the electrical resistor to ground with the thermal conductor, a thin layer of high thermal conductivity electrical insulator is interposed between the thermal conductor and the body of the resistor. Accordingly, a resistor can carry large amounts of current because the high conductivity thermal conductor will conduct heat away from the resistor to a heat sink. Various configurations of thermal conductors and heat sinks are provided offering good thermal conductive properties in addition to reduced parasitic capacitances and other parasitic electrical effects, which would reduce the high frequency response of the electrical resistor. |
Application Number
申请号 |
200610005833 |
Application Date
申请日 |
2006.01.10 |
| Title 名称 |
Heat sink, heat interface and cooling method for resistor
|
Publication Number
公开号 |
1828877 |
Publication Date
公开日 |
2006.09.06 |
| Approval Pub. Date |
|
Granted Pub. Date |
|
| International Classification 分类号 |
H01L23/373 |
Applicant(s) Name
申请人 |
IBM |
| Address 地址 |
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| Inventor(s) Name 发明人 |
Coolbaugh Douglas D., Eshun Ebenezer E., Hook Terence B., Rassel Robert M., Sprogis Edmund J., Stamper Anthony K. |
| Attorney & Agent 代理人 |
zhang gao |
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