Original document(12 pages)  中文版
    The present invention provides method to realize circuit distribution. The present invention uses lattice point power supply connection point/punch hole to substitute strip shaped power supply distribution in every fundamental circuit unit distribution design, after permutation and combination of every circuit unit, through winding distribution to connect every circuit unit to power supply. The present invention can effectively reduce every circuit unit distribution height and increase integrated circuit density of integration.
Application Number
申请号		 200510052676 Application Date
申请日		 2005.03.03
Title 名称 Method for realizing circuit layout
Publication Number
公开号		 1828864 Publication Date
公开日		 2006.09.06
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H01L21/82,G06F17/50
Applicant(s) Name
申请人		 UMC Corporation
Address 地址
Inventor(s) Name 发明人
Attorney & Agent 代理人 bo maiwen huang xiaolin

  
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