Original document(14 pages)  中文版
    Title: Semiconductor package having filler metal of gold/silver/copper alloy
Application Number
申请号		 200480015893 Application Date
申请日		 2004.05.19
Title 名称 Semiconductor package having filler metal of gold/silver/copper alloy
Publication Number
公开号		 1802740 Publication Date
公开日		 2006.07.12
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H01L23/02
Applicant(s) Name
申请人		 Kyocera America Inc.
Address 地址
Inventor(s) Name 发明人 Lobsinger Joshua David, Shane Michael John
Attorney & Agent 代理人 tao fengbei hou yu

  
Semiconductor device
Semiconductor package having optimized wire bond positioning
Layered microelectronic contact and method for fabricating same
Electric interconnect structure of integrate circuit and manufacture methods thereof
Power distribution network of an integrated circuit
Package for a high-frequency electronic device
Electronic device, information processor, and electromagnetic radiation suppressing member
Semiconductor device and its manufacturing method
Frequency conversion circuit for direct conversion receiving, semiconductor integrated circuit therefor, and direct conversion receiver
Improved imager light shield
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