Original document(6 pages)  中文版
    The invention relates to a thermal compression bonding method of polymer micro-liquid system. First, cleaning the surface of a polymer with micro structure and the surface of another polymer without micro structure and keeping them dry, which is characterized in that adding the monomer or homologue of said polymer into the surface of polymer without said micro structure, while the added amount is 10-40% of the weight of added polymer surface, and the adding depth is 0.1-10 micrometers; arranging said two surfaces face-to-face between two plates and adding the pressure of 0.5-5MPa to be heated in the temperature which is lower 5-20Deg. C than the vitrification temperature of said polymer for 2 minutes; removing pressure to be cooled slowly to room temperature to attain bonded polymer micro-liquid system. The adding method can select steam method, rotary plating method or dipping method. The invention can reduce the vitrification temperature of polymer surface, solve the bonding strength problem, and improve the bonding efficiency via adding polymer monomer or homologue, while it has simple process and the application to the bonding of polymer micro structures with different surface flatness.
Application Number
申请号
200410103236 Application Date
申请日
2004.12.31
Title 名称 Hot compressing link method of polymer microfluid system
Publication Number
公开号
1799820 Publication Date
公开日
2006.07.12
Approval Pub. Date Granted Pub. Date
International Classification 分类号 B29C65/02
Applicant(s) Name
申请人
University of Science & Technology of China
Address 地址 230026
Inventor(s) Name 发明人 Liu Gang, Zhu Xuelin, Tian Yangchao
Attorney & Agent 代理人 yu chengdun

  
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