Dual damascene interconnect structures having different materials for line and via conductors

Original document(29 pages) 中文版

Title: Dual damascene interconnect structures having different materials for line and via conductors

Application Number 申请号	200480014958	Application Date 申请日	2004.06.14
Title 名称	Dual damascene interconnect structures having different materials for line and via conductors
Publication Number 公开号	1799137	Publication Date 公开日	2006.07.05
Approval Pub. Date		Granted Pub. Date
International Classification 分类号	H01L21/768
Applicant(s) Name 申请人	IBM
Address 地址
Inventor(s) Name 发明人	Gambino Jeffrey, Cooney Edward III, Stamper Anthony, Motsiff Thomas, Lane Michael
Attorney & Agent 代理人	qin chen

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