Original document(13 pages)  中文版
    Title: Formation of junctions and silicides with reduced thermal budget
Application Number
申请号		 200480015369 Application Date
申请日		 2004.05.19
Title 名称 Formation of junctions and silicides with reduced thermal budget
Publication Number
公开号		 1799125 Publication Date
公开日		 2006.07.05
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H01L21/285
Applicant(s) Name
申请人		 Koninkl Philips Electronics NV
Address 地址
Inventor(s) Name 发明人
Attorney & Agent 代理人 wang yang

  
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