Original document(17 pages)  中文版
    Title: Semiconductor structure and manufacturing method theereof
Application Number
申请号
200510123360 Application Date
申请日
2005.11.23
Title 名称 Semiconductor structure and manufacturing method theereof
Publication Number
公开号
1794442 Publication Date
公开日
2006.06.28
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H01L21/82,H01L27/02
Applicant(s) Name
申请人
Taiwan Semiconductor Manufacturing Co., Ltd.
Address 地址
Inventor(s) Name 发明人 Cai Bangyan, Zhang Zhijian, Yang Tingyu, Li Ziliang
Attorney & Agent 代理人 shou ning zhang huahui

  
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Micron scale chip size packaging radiation structure
Water cooling method and device of electric transmission power electron power inverter
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