A gate wire including a plurality of gate lines, a plurality of gate pads 125 connected to one ends of the gate lines, and a plurality of gate electrodes 123 connected to the gate lines, and a storage wire for receiving a common voltage are formed on the substrate. A semiconductor layer and an ohmic contact layer are formed on the gate insulating layer covering the gate wire and the storage wire. A data wire including a plurality of data lines defining a plurality of pixel areas along with the gate lines, a plurality of source electrodes extending onto the semiconductor layer, and a plurality of drain electrodes separated from the source electrodes and opposite the source electrodes with respect to the gate lines is formed thereon. A plurality of storage capacitor conductors overlapping the storage wire to form storage capacitance are formed on the gate insulating layer. The storage capacitor conductors include a plurality of repairing portions extended therefrom and overlapping the gate lines. A passivation layer is formed on the data wire and portions of the semiconductor layer which are not covered with the data wire, and a plurality of pixel electrodes connected to the drain electrodes and the storage capacitor conductors through a plurality of contact holes provide at the passivation layer are formed on the passivation layer. |