Original document(11 pages) Authorized document(11 pages) 中文版
    A probing adapter for Ball-Grid-Array packages has an elongate body with a centrally disposed slotted region formed therein containing a slider that is movable within the slotted region. An electrically conductive plunger is attached to the slider and electrically coupled to an electrical contact exposed outside of the probe body. An electrode extends from the plunger and through an aperture formed in one end of the probe body to expose a hooked-shaped contact for making electrical contact with a solder ball contact of the ball grid assay package.
Application Number
申请号
00108718 Application Date
申请日
2000.05.26
Title 名称 Probe adapter for spherical grid array component
Publication Number
公开号
1275719 Publication Date
公开日
2000.12.06
Approval Pub. Date 2004.12.15 Granted Pub. Date 2004.12.15
International Classification 分类号 G01R1/067;G01R31/26;H01L21/66
Applicant(s) Name
申请人
Tectlanic Corp.
Address 地址
Inventor(s) Name 发明人 J. A. Kanbel;R. A. Zandonadi
Attorney & Agent 代理人 xiao chunjing

  
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