Original document(16 pages) Authorized document(16 pages) 中文版
    The connection terminal provided on the surface of the film substrate is composed of the electorde connection portion 11c and the plane circuit reinforcement portion provided on the front terminal of the connection terminal. The result is, the reduction of the length of a side of the connection electrode provided on the underside of the semiconductor chip and the arranged pitch. The boarding accuracy must be considered when the semiconductor chip is carried on the film substrate, so as to reduce the width of the connection terminal main body portion smaller than the length of a side of the connection electrode to a certain extent, such that the diameter of the reinforcement portion is the same as that of the length of a side of the connection electrode. And then the reinforcement portion is not easy to be stripped off from the film substrate.
Application Number
申请号
00103436 Application Date
申请日
2000.03.08
Title 名称 Terminal structure to connect electronic component thereon
Publication Number
公开号
1267180 Publication Date
公开日
2000.09.20
Approval Pub. Date 2005.01.05 Granted Pub. Date 2005.01.05
International Classification 分类号 H05K1/18
Applicant(s) Name
申请人
Casio Computer Co., Ltd.
Address 地址
Inventor(s) Name 发明人 Saito Koichi;Sugiyama Kazuhiro
Attorney & Agent 代理人 du juan

  
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