Original document(19 pages) Authorized document(8 pages) 中文版
    The mfg method of gold and tin solder (contains Sn 18-23%, remainder is Au) is used for semiconductor device in large power and advanced technique field. Its feature is that uses multi-layered complex technique to put separately the pretreated and rolled into gold tape and tin tape of certain thickness, which are piled up layen upon layer with mutual alternation according to Au/Sn/Au....../Sn/Au (at least five layers) and makes complex blank by prepressing, then the required standard foil is made by cold rolling. This invented method can guanrantee firmly eutectic reation of solder under the temp. of braze welding to gain the brazed joint with even and dense composition. This method is simple, easy to apply and the mfd. solder foil can form various shapes and standards welding sheets with ordinary die, the prod rate is high and is suitable for the industrial batch prodn.
Application Number
申请号
92102647 Application Date
申请日
1992.04.09
Title 名称 Mfg. method of aurum tin soldering material
Publication Number
公开号
1066411 Publication Date
公开日
1992.11.25
Approval Pub. Date Granted Pub. Date 1994.11.02
International Classification 分类号 B23K35/30,B23K35/40
Applicant(s) Name
申请人
Kunming Noble Metal Research Inst. Under Chinese Non-ferrous Metal Industry Gene
Address 地址 650221
Inventor(s) Name 发明人 Gu Kaiyuan, Liu Zeguang
Attorney & Agent 代理人 HE TONGPEI

  
Silver alloy solder with low palladium content
Low-steam pressure low melting point silver based soldering alloy
Gold soldering flux ally for fine gold adornment
Gold soldering flux alloy for fine gold adornment
Silver basis soldering paste and Brazing method for silver ornaments
Copper basis soldering paste and brazing method for copper ornaments
Composite solder and its prodn process
Composite brazing alloy and its producing method
Tin base alloy solder
Mixed powder solder and its production process
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