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Molecular formula : MW : CAS :
nature : plastic pieces non conductor, it must obtain the surface layer of conductive plating layer can be carried out. It should also be noted how it is a good bonding. To meet the above requirements, subject to the following address : (1) of crude chemical used to make chemical etching agent plastic surface roughness, surface area and increase production of certain polar groups, by hydrophobic surface hydrophilic into; (2) - processing, plastic surface adsorption layer of the material easily oxidized in order to activate the next time of the reduced metal catalysts; (3) activation, so a plastic surface TLC catalytic metals, chemical plating at the redox reaction of the catalyst.
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