Molecular formula :
nature : suitable for use in high temperature adhesive. Available resistant polyimide, Polybenzimidazole, silicone resin, produced 61 Poly (see the article). 250 ° C above the temperature still has a good bond, electrical properties and resistance to radiation and so on. But most of curing temperature required 200 ° C For aluminum, stainless steel, ceramics, glass, metal honeycomb structure of the bonding and sealing.
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