Home  Products Search  Properties Search  ä¸­æ–‡ç‰ˆ
Home > Dictionary > Information
alum;vitriol
Molecular formula :
MW :
CAS :

nature : a divalent metal (M + / sup>) or ammonium ions (NH4 + ) and the three metals (< M3 + / sup>) sulfate salt water of the tributaries. Many types. Formula for M2 SO4 �M23 + + (SO4) 3 �24H2O . For example alum K2SO4 �Al2 (SO4) 3 �24H2O, iron ammonium sulfate (NH4) 2SO 4 Fe2 (SO4) 3 �24H2O, chromium alum (chromium potassium alum) K2SO4 �Cr2 (SOs _4) 3 �24H2O so.


Notice:Each item can have many explanations from different angels. If you want grasp the item comprehensively,please see below "more details data".
Structure:
Please see below "More Detailed Data"
More Detailed Data:
1) Cupric sulfate;Blue vitriol;Copper sulfate
2) cupric sulfate;copper sulfate;blue vitriol;Roman vitriol
3) white vitriol;zinc sulfate heptahydrate
4) iron vitriol;ferrous sulfate heptahydrate
5) Sulfuric acid, zinc salt;Zinc sulfate, heptahydrate;Zinc vitriol;zinc sulfate;bonazen;bufopto zinc sulfate;complexonat
6) cupric sulfate;copper sulfate;bule vitriol;Roman vitriol
7) zinc sulfate;white vitriol;zinc sulfate heptahydrate
8) ferrous sulfate;green copperas;green vitriol;ferrisulfas
9) Sulfuric acid, iron salt;Ferrous sulfate;Green vitriol;Iron sulfate;iron sulfate;copperas;duretter
10) green vitriol;ferrous sulfate septihydrate
Notice Some description was translated by software and the data is only as a reference.
Patent:
1) Al/Ti/Al/Pt/Au ohmic contact system adapted to GaN device
2) Al/Ti/Al/Ni/Au ohmic contact system adapted to GaN device
3) Ti/Al/Ti/Pt/Au ohmic contact system adapted to GaN device
4) Al/Ti/Al/Ti/Au ohmic contact system adapted to GaN device
5) Silicon-based material layer, forming method, structure, device, emitter and display incorporating the silicon-based material layer
6) Film forming method, film forming device and storage medium
7) Method of controlling crystal surface morphology using metal adsorption
8) TV and electronic apparatus and method for making semiconductor member
9) Intermetallic spring structure
10) Systems and methods for temperature control of semiconductor wafers